The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary.
The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems.
Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety.
Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
"...provides essential information on the design & packaging of electronic devices & systems covering topics such as design automation, new IC packaging technologies, materials, testing & safety issues."

zlib/no-category/Glenn R. Blackwell/The Electronic Packaging Handbook_17398905.lit

edited by Glenn R. Blackwell

Auerbach Publishers, Incorporated

Chapman & Hall/CRC

CRC Press LLC

The Electronics handbook series, Boca Raton, New York, Unknown, 2000

Electronics handbook series, Boca Raton, Fla, Florida, 2000

The Electrical Engineers Handbook Series, November 29, 1999

United States, United States of America

1, 1999

Includes bibliographical references and index

Библиогр. в конце разд.
Указ.

РГБ

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This handbook provides information on the design and packaging of electronic devices and systems. It should be useful to engineers and technicians involved in any aspect of their design, production, testing or packaging. Topics covered include design automation and new IC packaging technologies. The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field

"The demand for smaller, faster and lighter electronic products represents a challenge for designers - they need information from a wide range of specialty technologies. In The Electronic Packaging Handbook, industry and academic experts come together to provide the information essential to meeting this demand." "Emphasizing the need to consider design, manufacturing, and test demands during the design phase of any product, the handbook begins with introductory material for readers new to the electronics packaging arena. It then provides valuable information on circuit boards, testing, hybrid circuits, failure analysis, reliability, and much more."--Résumé de l'éditeur

The packaging of electronic systems and devices represents a serious challenge for designers managers. A major new entry in the Electrical Engineering series, The Electronic Packaging Handbook provides essential information on the design and packaging of electronic devices and systems. The book is valuable to engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products. Topics covered include design automated new IC packaging technologies, materials, testing, and safety issues.

Проектирование, производство и контроль микроэлектронных сборок. Справочник

2021-09-23